1. The control system adopts PLC, and the host computer adopts computer, equipped with genuine Windows XP operating system and 18-inch LCD monitor to ensure the stability and reliability of the control system.

2. The control software is powerful, with flexible process parameter control and temperature curve testing functions, and the Chinese and English operation interfaces can be switched at any time.

3. Use WOGO terminal blocks; all important electrical components are imported brands, and all signal lines are shielded.

4. The temperature module is self-tuning, the cold end is automatically compensated, and the temperature is controlled at ±2℃.

5. Equipped with a mesh belt tensioning device, the transportation is stable, without shaking or deformation, ensuring smooth PCB transportation;

6. All heating zones are PID controlled by the temperature controller (the upper 8 zones and the lower 8 zones are independently temperature controlled and can be turned on separately. Zone heating can be carried out to reduce starting power);

4. With fault sound and light alarm function;

5. Equipped with leakage protector to ensure the safety of operators and control systems;

6. Built-in board ejection and automatic delayed shutdown system to ensure that the PCB and reflow soldering machine are not damaged in case of power failure or overheating;

7. The hot air circulation heating method adopted has uniform temperature, high thermal compensation efficiency, and high-efficiency pressurized accelerating air duct, which greatly increases the circulating hot air flow, heats up quickly (about 20 minutes), has high thermal compensation efficiency, and can perform high-temperature welding and curing;

8. The upper 8 and lower 8 temperature zones are equipped with independent temperature sensing sensors to monitor and compensate the temperature balance of each temperature zone in real time;

9. Specially designed supercharged air flow structure and special-shaped heating wire design, no noise, no vibration, with extremely high heat exchange rate, the temperature difference △t between the bottom of BGA and PCB board is extremely small, which is more in line with the strict requirements of lead-free process, especially for lead-free products with high welding requirements.